| Molecular simulation study on adhesions and deformations for Polymethyl Methacrylate (PMMA) resist in nanoimprint lithography
Sungjin Kwon, Youngmin Lee, Jaeshin Park and Seyoung Im*
The Journal of Mechanical Science and Technology, vol. 25, no. 9, pp.2311-2322, 2011
Abstract : The NIL (nanoimprint lithography) process is explored through numerical simulation, utilizing MD (molecular dynamics), with a focus
on the resin deformations and the adhesion between the resin material and the tool. For the force-field of the Polymethyl Methacrylate
(PMMA), used for the resin material, a united atom model is employed. For temperature control in the MD simulation, the recursive
multiple chains of the Nosé-Poincaré thermostat is applied. The deformation and adhesion in the NIL process are explored from the mechanics
viewpoint based on the present MD results. In particular, the adhesion behavior of a self-assembly monolayer (SAM) in the
stamp-releasing stage is discussed in connection with the monolayer thickness.
Keyword : Adhesion; Molecular dynamics; Nanoimprint lithography; Nosé-Poincaré thermostat; PMMA (polymethyl methacrylate); Self-assembly monolayer |
