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study on the behaviors and stresses of O-ring under uniform squeeze rates and internal pressure by transparent type photoelastic experiment
Jeong-Hwan Nam, Jai-Sug Hawong*, Dong-Chul Shin and Bruno R. Mose
The Journal of Mechanical Science and Technology, vol. 25, no. 9, pp.2427-2438, 2011
Abstract : The behaviors and stresses of an O-ring under uniform squeeze rates and internal pressure change with real time. Therefore, the behaviors
and stresses of O-rings under uniform squeeze rates and internal pressures should be studied with real time. To achieve this, a loading
device for a transparent type photoelastic experiment, through which various internal pressures and uniform squeeze rates are applied,
was developed. The validity of the loading device in analyzing the behaviors and stresses of the O-ring under uniform squeeze rates and
internal pressures with real time was verified. It was observed that the filling phenomenon of the O-ring into the space between the lower
and front side occurred after forcing out continued for a duration of time. The study also indicated that maximum shear stress would be
more effective as a fracture parameter than the maximum normal stress fracture criterion for an O-ring made from rubber.
Keyword : Behavior of O-ring; Stresses of O-ring; Squeeze rates; Internal pressures; Forcing out; Loading device; Photoelastic experiment; Maximum shear stress; Maximum normal stress |
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