Shanglong Xu*, Guangxin Hu, Jie Qin and Yue Yang
The Journal of Mechanical Science and Technology, vol. 26, no. 4, pp.1257-1263, 2012

Abstract : Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip’s temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks.

Keyword : Microchannel; Heat sink; Heat dissipation; Heat-flow coupling; Structure