|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Investigation on thermal characteristics of heat sinks for power module using STM
Chung-Hyo Jung
The Journal of Mechanical Science and Technology, vol. 23, no. 3, pp.686-697, 2009
Abstract : The device that controls dynamic motions in a washing machine is called as MICOM. This device includes an IPM
that controls the rotation of a tub. Also, the overheating of IPM gives cause for lowering the service life of an applied
chip and is directly linked with its faults. A heat sink that is larger than the volume of the applied chip more than 50
times is installed to prevent such overheating. In the operation of the IPM, the temperature specification of the heat sink
can be determined as 80¡É under the air temperature of 25¡É. However, the heat sink used at the present time cannot
satisfy this condition, so it is necessary to redesign such a heat sink to satisfy this condition. This study proposes an
STM that is able to precisely calculate the temperature applied to IPM in a system level prior to redesigning the heat
sink. The STM can be considered as a model that complements a JEDEC analysis model. This model implements a
parameter analysis to perform the optimization of a heat sink and verifies the priority of parameters to reduce material
costs. Furthermore, it investigates a counterproposal that replaces the conventional cooling methods in which it seeks a
counterproposal that performs heat dissipation in a device according to the SoC of chips and is able to suppress EMI.
Keyword : CFD; Heat sink; IPM(intelligent power module); JEDEC(joint electron device engineering council); PBA(printed board |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
JMST Editorial Office: #702 KSTC New Bldg, 22 7-gil, Teheran-ro, Gangnam-gu, Seoul 06130, Korea
TEL: +82-2-501-3605, E-mail: editorial@j-mst.org |
JMST Production Office: #702 KSTC New Bldg, 22 7-gil, Teheran-ro, Gangnam-gu, Seoul 06130, Korea
TEL: +82-2-501-6056, FAX: +82-2-501-3649, E-mail: editorial@j-mst.org |
|
|
|
|