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| Development of an automatic vegetable bundling machine using thermal bonding
Yong-Seok Kim/Soon-Yong Yang
The Journal of Mechanical Science and Technology, vol. 23, no. 12, pp.3366-3373, 2009
Abstract : An automatic vegetable bundling mechanism that uses thermal bonding is proposed. The proposed mechanism consists
of three modules for reasonable manufacturing. The design specifications were determined by a bundling mechanism
that was mechanically optimized, and a prototype of the automatic bundling machine was manufactured. A field
test was carried out to verify the performance of the prototype on a vegetable farm. The machine showed an efficiency
of about 3.6 times that by manual work. This automatic vegetable bundling machine has already been approved as an
agricultural machine and will be commercialized soon.
Keyword : bonding; Bundling machine; Bundling mechanism; Vegetable bundle; Packing |
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TEL: +82-2-501-3605, E-mail: editorial@j-mst.org |
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